Wednesday, March 18, 2026

How DeepX’s Low-Power AI Chips are Transforming the Future of AI: Insights from CES 2026

DeepX announced on January 22 that it attracted over 20,000 visitors during the four-day Consumer Electronics Show (CES) 2026, which concluded last week.

At the expo, DeepX unveiled its “Physical AI Infrastructure” strategy, addressing power consumption, heat generation, and cost issues plaguing traditional data center-centric AI. The company showcased a groundbreaking semiconductor roadmap, demonstrating the ability to run large language models (LLMs) with 20 to 100 billion parameters using less than 5 watts of power. This innovation suggests that generative AI could soon operate on everyday battery-powered devices, not just servers.

Analysis of visitor data revealed that 58% of attendees were high-level decision-makers, including C-suite executives, board members, and founders. Moreover, 54% of visitors held significant purchasing authority. International attendance was strong, with about 65% of visitors coming from overseas.

DeepX’s technological achievements earned official recognition at the event. For the second year running, the company was featured as a top trend in the Consumer Technology Association’s (CTA) official Must-See Exhibits at CES 2026 guide. The CTA identified on-device AI and physical AI as key trends, positioning DeepX alongside tech giants like Nvidia, AMD, and Qualcomm as companies to watch closely.

A DeepX spokesperson commented, “Our success at CES underscores our evolution from a semiconductor startup to a global leader setting new standards in AI infrastructure. We are now poised to accelerate the mass production and distribution of physical AI semiconductors, responding to clear global demand.”

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