Telechips, a company specializing in automotive semiconductors, has unveiled its first System-in-Package (SIP) module, which integrates various semiconductors into a single package. The SIP module is expected to help automakers and automotive electronics companies reduce manufacturing costs, shorten development time, and improve quality, positioning Telechips further to strengthen its presence in the automotive semiconductor market.
According to Telechips, the SIP module will be a product that integrates memory semiconductors, application processors (AP), and power management ICs (PMIC) into a single package on Tuesday. This allows automakers and automotive electronics companies to quickly adopt a high-performance solution without the burden of optimizing memory and power configurations.
It also reduces the number of layers and the size of the mainboard’s printed circuit board (PCB), helping to lower manufacturing costs and enabling more efficient use of hardware development time and engineering resources. In particular, it enhances quality and stability during mass production, allowing for more reliable product delivery.
Automakers and automotive electronics companies previously had to invest significant time and engineering resources to optimize existing automotive APs and memory semiconductors. They also had the burden of redesigning and revalidating systems whenever a new semiconductor was introduced.
The Telechips SIP module supports a “pin-compatible” approach, allowing components to be replaced or upgraded without modifying the existing mainboard design. This improves development and production efficiency and, through standardized design, enables new features to be added with minimal changes while maintaining the existing platform. As a result, it offers advantages like lower overall development costs and a shorter time to market.
In particular, using the “Dolphin3” SIP module allows for an easy upgrade to Dolphin5 or Dolphin7 without changing the existing mainboard. This accelerates new product launches and reduces development costs, enabling scalability from Dolphin3 to Dolphin7 with a single hardware design.
It also supports a common “SDK” for the Dolphin family, maintaining software compatibility while achieving up to a fourfold increase in CPU performance during upgrades. The Dolphin family is Telechips’ leading line of automotive infotainment APs.
Telechips has released SIP modules for its infotainment APs, including Dolphin3, Dolphin5, and Dolphin7, and its AI accelerator product line A2X. Dolphin3 and Dolphin5 are scheduled for mass production within the year. This will allow the company to pursue a two-track strategy by attracting new clients while offering greater design convenience to existing ones.
The company has already provided its prototype to clients and is currently conducting evaluations. Based on this, it plans to offer solutions optimized to industry needs.
Kim Sung Jae, Head of Business Division at Telechips, said, “The SIP module business will go beyond simply providing technology to become an integrated solution that dramatically addresses complex development, cost reduction, and production efficiency challenges.” He added, “By leveraging the synergy of hardware modules and software packages, we aim to build competitiveness in the automotive semiconductor market, where performance, power efficiency, and stability are critical.”
